High-performance computing for embedded system applications is pushing the envelope for speed, a small form-factor, and the right price-point. Designers need to carefully balance material selection and PCB fabrication options, together with smart design strategies for vias, connectors and PCB trace routing. In this webinar we will walk through the simulation process that SECO Italy have undertaken to ensure design success.
- The benefits of using Standard-Specific PCIe Gen5 Tx and Rx AMI models
- An optimization strategy for differential-vias
- An example of Electromagnetic (EM) simulation of modular PCBs with comparison to prototypes