Keysight World Technical Week - High Speed Digital Track
High-speed digital standards are quickly evolving to keep pace with emerging technologies such as 5G, Internet of Things (IoT), artificial intelligence (AI), virtual reality (VR), and autonomous vehicles. Each generational change introduces new test challenges for your digital designs. Learn the latest PCIe 5/6 update, successful USB-4 testing, and be the first to know about testing 400/800G.
Select one or more webinars of interest, then submit registration form.
PCIe Gen5/6 Update! Overview and Challenges
Available On-Demand

PCI-SIG® is preparing for the official test of PCI Express® Gen5, but on the other hand, Gen6 standard is being formulated with the aim of further speeding up to meet the demands of the market. Gen6 adopts 32Gbd PAM-4, which involves different design and evaluation issues. In this seminar, we will introduce the latest information update of Gen5 and its physical layer solution focusing on new issues of Gen6.
The Latest Updates for Successfully Test USB4
Available On-Demand

The introduction of USB4 is finally in full swing. The technical difficulty to achieve high-speed transmission of up to 40 Gbps per cable is higher than before. Success in USB4 product development requires a good understanding of the technical challenges and measurement methods of USB4 and Type C connector related technologies. In this seminar, we will introduce the latest information on the latest evaluation method of USB4 and the keysight measurement solution that realizes it.
Industry Trends, Technology Changes and their Impact on Test
Available On-Demand

The world continues to be inundated with new technologies that make everyone’s lives better.  Data Center Traffic is expected to continue at its blistering pace through 2030 and beyond.  Everyone knows the trends that drive this traffic.  The underlying technologies are all moving to new generations with faster speeds and more advanced modulation schemes.  For instance PCIExpress is moving to Pulse Amplitude Modulation with 4 levels (PAM-4), USB is moving to PAM-3 and the list continues.  Inside the data center, we see a new “composable/fungible” data center architecture is moving to build upon the hyper scaling data centers we saw begin to emerge a decade ago.  Even the chips themselves are advance with the drive to 3nm and the drive to put multiple chips onto a single piece of silicon.  While it is exciting to see all of these technologies; testing them is a challenge.  “Industry Trends, Technology Changes and their Impact on Test” walks everyone through the technology changes and industry trends, while providing more clarity into the keys to staying informed about testing needs.
Digital Transformation: The Next 25 Years
Available On-Demand

Two forces are undeniable: the speed at which technology changes and the sheer volume of data the world produces. Across every organization, senior leaders face difficult decisions around harnessing and analyzing these forces. Listen in to this stimulating panel discussion as we envision the next 25 years and outline a path forward that will enable companies to not just survive, but thrive.
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