Register now for the Advanced EM Class on September 14-16, 2021

Who should attend?

Engineers and scientists who work in an RF, microwave or mm-wave design environment and want an in-depth understanding of designing circuits using the dominant 3D EM simulation technologies.

Prerequisites:

Knowledge of ADS layout and schematic capture, circuit simulations and data display. Familiarity with fundamental RF and microwave concepts. PC and MS Windows experience.

What will you learn

By attending these classes, you will significantly bootstrap yourself into proficient understanding and usage of Momentum simulations, meshing, Momentum RF and Momentum Microwave, and the common EM GUI for MoM and FEM. This 3 day class allows to expand you knowledge into the advanced and powerful capabilities built on top of the basic infrastructure. These important capabilities, some of them unique amongst all the modern RF/microwave simulators, are necessary for almost any complex designs found in modern circuits.

Course Length: 3 Days

Course Format: Virtual Class

Agenda

Day 1: EM Component Parameterization, Cosimulation & Cooptimization

EM Component parameterization is the basis for EM-circuit-system cooptimizations. Learn the two methods to convert static to parameterized geometries – Nominal/Perturbed graphical and Subcircuit component based.
Compare traditional “puzzle-piece” modeling approaches to modeling an entire geometry in a single EM simulation.
Understand and efficiently use thick conductor modeling using LTCC spiral inductors as examples.
For custom geometries with complex parameterization requirements, learn how to define AEL artwork macros and convert them to EM Components.

Day 2: Efficient CPW & Multilayer Modeling & Analysis of Differential Structures

Use slot layers to efficiently model (CPW) Coplanar Waveguide and multilayer PCB structures.
Learn the different grounding concepts such as localized grounds and return paths vs. ground at infinity, and differential signaling.
Perform pure differential and mixed-mode (common–differential) S Parameter simulations using schematic templates and DDS equations and understand the implications this has on real world differential signal routing.

Day 3: Multitechnology Structures, IC Packaging, Modules, SiP

The Finite Element Method is the most general 3D simulation technique and allows users to simulate IC or multi-chip module packages and many other structures that Momentum cannot represent.
FEM can also be used to validate Momentum simulations to increase confidence levels.
In this class, you will also learn why building 3D models from a 2D layout user-interface has significant benefits over having to draw 3D structures in a CAD UI.

Price

The cost of the 3-day class is $1770 USD

Additional Information

You can consider the registration form as a formal quotation from Keysight; however, completion and submission of the registration form need to be done 10 business days prior to the event.

Take the first step towards increasing your design productivity by signing now.

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